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RA CORED WIRE SOLDER

RA is a fully activated, general-purpose wire solder for use in applications where mildly activated fluxes are too weak. RA cored wire is strong enough for excellent tarnish and oxide removal, and will produce bright shiny solder joints. RA wire will leave slight to moderate post process residues that may be left on noncritical applications, but should be removed from any critical applications. RA cored wire meets Mil-Spec cleanliness requirements post-cleaning. IPC flux classification for this material is ROM1.

WS482 WATER SOLUBLE CORED WIRE SOLDER

WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste chemistries. WS482 offers improved thermal stability, allowing it to be processed with standard or high temperature alloys. WS482 offers residues that are non-corrosive and therefore may be used without cleaning for applications where conductivity will not cause a problem (such as soldering wires). Post-process residues are safe to remain on many assemblies for up to two to three days.

209AXT NO CLEAN CORED WIRE SOLDER

209AXT is a no-clean, synthetic resin-based flux core which is the same chemistry as that of AIM’s no-clean solder pastes. 209AXT flux promotes good thermal transfer, offering better solder penetration into plated through holes or surface mount interconnections. 209AXT cored wire produces low-to-medium post-process residues that are electrically safe and do not require cleaning. 209AXT is operator-friendly and can be used as a drop-in for any RMA type applications. IPC flux classification for this material is REL0.

OAJ CORED WATER SOLUBLE WIRE SOLDER

OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide provides a high activation level that produces excellent tarnish or oxide removal, and maximum capillary action, leading to faster wetting, and reducing the chances of thermal degradation of the board materials. OAJ flux residue is readily soluble in hot water. IPC flux classification for this material is ORH1.

GLOW CORE NO CLEAN CORED WIRE SOLDER

Glow Core is a no-clean, resin-based flux cored wire solder designed to offer excellent wetting characteristics and lead-free compatibility. This product is very active and is recommended for fast cycle time soldering. Glow Core flux promotes good thermal transfer, offering better solder penetration into plated through holes or surface mount interconnections.

Lead Solder Alloys

AIM offers a wide variety of lead products and alloys to meet all customer requirements.

 

Fusible/Low Melting Temperature Alloys

AIM fusible alloys are low melting temperature alloys that contain bismuth, lead, tin, cadmium or indium. AIM’s fusible alloys are utilized in a broad variety of tool & die applications, including casting, tube bending, machining parts for soft metal dies, fixturing, anchoring parts, toggle dies and supporting castings and interrupted cuts.

Babbitt Bearing Metals

Babbitt is a white metal alloy that was patented by Isaac Babbitt in 1839.  Over time, the term Babbitt has been applied to other similar white metals comprised of tin, copper and antimony.  Lead can sometimes be added in place of the tin. Babbitt alloys offer corrosion resistance, excellent wetting, low wear and friction resistance and are known for their hard/soft composition.  While the tin and lead are soft, the copper and antimony form hard crystals throughout the structure.

Solder Joint Analysis

AIM’s Reliability Analysis Program

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