WS730 is a water-based, high activity liquid flux designed to offer low-spattering and excellent wetting, even to difficult-to-solder parts. WS730 is formulated for a variety of electronic, electrical and industrial applications, including wire, cable, and terminal lead tinning and soldering, flat and round wire fabrication, and semiconductor and component lead tinning.  WS730 will solder to copper, beryllium-copper, nickel, alloy 42, alloy 51, nickel, brass, some steels and other base metals.

RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning.  As a mildly activated rosin based flux, RMA 202-25 offers a wide process window, good cleaning properties, and excellent thermal transfer.

RA-301 is a fully activated rosin-based flux formulation containing 35% solids. RA-301 has a very wide process window, which makes it an acceptable alternative to a variety of environments and process applications.  RA-301 has a high activity level that provides bright, shiny solder joints and is very effective in tarnish or oxide removal.  

General Purpose Flux Thinner is a solvent that is used to thin Water Soluble, No Clean and RMA fluxes in foaming and some spray applications.  Common Flux Thinner is typically used in conjunction with the AIM n.020 Titration Kit.  Use of Common Flux Thinner is suggested when the flux acid number is too high due to solvent evaporation or residues increase due to evaporation.  Follow the instructions outlined in the AIM n.020 Titration Kit procedure when diluting flux products.